BGA Reballing kit

Soldering flux can be widely used in PCB mainboards of diffirent kinds such as computer, notebook, Xbox 360, PS3, PSP, cell phones, automobiles ...
It is used with BGA solder balls

BGA solder balls: leaded solder balls for leaded BGA Rework, melting point 183 degrees. Lead-free solder balls are used for lead-free rework.
 

BGA reballing stations for doing BGA reballing of notebook, Xbox360, notebook, xbox 360, PS3, Wii, PSP, and cell phones. We have diffirent BGA reballing stations for your selection.

 PS3 XBOX360 Mainboard Supports for xbox 360 fat, xbox 360 slim, PS3 40GB/60GB, PS3 slim 80GB, PS3 120GB

BGA reballing stencil kit are must for bga reballing. We have latest and diffirent kinds for notebook chips, xbox 360 chips, PS3 chips, Wii Chips, cell phone chips...and also universal bga reballing stencil kit are availble.

Other BGA reballing accessories such as ESD tweezers,ESD gloves,heatsink material,vacuum suction pens, hign temperature tapes, Foil tapes, desoldering wires,solder wick, BGA scrapers...