ACHI HR560 optical Alignment BGA rapair machine main features

ACHI HR15000 presents the new trend of BGA rework stations, very easy to operate.

Highlights of ACHI HR15000 as below:

1. Latest new optical alignment system, easy to operate, success rate can be 100%.
2. with laser positioning.
3. Automatic identify BGA chips ang mounting height.
4. Top heater device and mounjting head 2 in 1 design.
5. Semi amtomatic soldering and desoldering.
6. CCD Ssystem and Optical Alignment System combined, can change the Screen by one button.
7. Auto matic adjust chiromatism resolution and brightnes.
8. With Lase opsition.
9. With Micrometer to do Micro adjust.
10. With a powerful cross-flow fan to cool PCB rapidly to prevent it from deformation.
11. With 3 tempretture zone and 3 external temp sensor socket.

Alignment as below:

Laser positioning

CCD Camera for obseving the melting process

Automatic vacuum pump

Camera for easy alignment

Micro-adjust buttons

ACHI IR12000 Infrared BGA Rework Station 2014 latest released, main features as below:
1. Three temperature zones : top heater 80x80mm ELSTEIN RFS/80 heater, lower hot air, bottom preheating 350x210mm. They work independently and can be controlled and adjusted to meet actual need

2. Apply original imported ELSTEIN RFS/80 400W Ceramic from Germany, giving even heating. The max
temperature could up to 750°C.

3. Most easy operate infrared bga rework station with 7 inch high definition touch screen. Heating temperature, time, angle, cooling and vacuuming  all can be realized through the touch screen.

4. Real time setting and actual temperature profile display can be used to analyze and correct parameters when needed.

5. PID control, instant profile analysis function

6. Can store unlimited temperature profiles, 2 groups already stored.

7. Removable fixture and 6pcs rework support jis  it make positioning mainboards much more easy and protect mainboards from damage and deformation efficiently. Irregular mainboards can be repaired too.

8. Uses advanced OMEGA K-type thermocouple to get accurate temperature detection

9. Closedloop Temperature control and automatic temperature adjustment system, with PLC and temperature module to enable precision temperature control of ±2 deg C

10. External temperature sensor enables accurate monitoring and analysis of real time temperature profile.

11. Equipped with various size BGA air nozzles, they can be adjusted in 360 degrees with easy installation and replacement.

12. High powered blower to enable fast cooling of PCB board and prolong using life of machine . 

13.  Internal vacuum pump and external vacuum pen to assist picking up the BGA chip.

14.  Function of alarming and cooling system.
The machine will alarm before 5-10 seconds of the soldering or desoldering finished,
Cooling system will start after vertical wind stopped heating.
When the temperature drops to room temperature, the cooling process will stop

15. Emergency Switch and Automatic power -off protection device to help safe using.

14. USB interface for ungrading the machine software.
Detailed  pictures for ACHI IR12000 infared BGA rework station

ACHI IR6500 Infrared BGA rework Station is a popular BGA rework station uses advanced dark infrared technology. 1. High temperature tempered glass to make sure even heat.

2.USB interface easy to be connected with computer.

3. Support jig added, make locating mainboards eaily.

4. Advanced external OMEGA K type thermocouple wire provide accurate temperature detection.

5. Safe emergeny power switch to make sure the machine stop working when emergency happen.

6. Alarming function. When soldering or desoldering will be finished, it will alarm before 3-5 seconds.

7. No hot air during rework process, make even heat and protect the surrounding compnents from damage and deformation.

8. Can store 10 groups of temperature profiles. Two groups already stored for using.

9. Can be controlled by the IRSOFT temperature software.

10. Two temperature zones, work independently, temperature parameters are adjustable and correct per actual need.

11. Can rework BGA chip size large as to 70x70mm
 

ACHI IR-PRO-SC BGA reballing machine main features

1. ACHI-IR-PRO-SC uses advanced dark infrared technology.

2. Without hot air flowing during the reworking, it will not affect the surrounding small components during reworking.

3. It can be connected to computer by RS232 serial port to realize computer control. And it also can be programmable with soft.

4. It can set up 8 rising temperature segments and 8 constant temperature segments to control. It can save 10 groups of temperature curves at one time. Which is enough for most of the using.

5. ACHI IR PRO SC is with sensitive temperature measurement sensor which can obtain an accurate and instantaneous temperature reading and monitoring.

6. It uses closed-loop temperature control ensures accurate temperature process and even heat distribution.

7. It is with linear guide type bracket for BGA Reworks which can be locked and adjusted by rotating its handle, which makes PCB board fixing very easily, and also protect the PCB board from deformation.

8.The maximum temperature of ACHI IR-PRO-SC can be up to 400 degrees, and it can be widely used in both leaded and lead free SMD rework.

ACHI IR6000 low cost BGA rework station, latest version new added USB interface. Main features as below:

1. Advanced dark infrared technology, give more even heat during reworking.

2. New added USB interface, can be connected with computer easily.

3. Closed-loop temperature control

4. Advanced external OMEGA K type thermocouple wire provide accurate temperature detection.

5. Alarming function. When soldering or desoldering will be finished, it will alarm before 3-5 seconds.

6. No hot air during rework process, make even heat and protect the surrounding compnents from damage and deformation.

7. Can store 10 groups of temperature profiles. Two groups already stored for using.

8. Can be controlled by the IRSOFT temperature software.

9. Two temperature zones, work independently, temperature parameters are adjustable and correct per actual need.

10. Can rework BGA chip size large as to 65x65mm