管理首页 > Products
  • sitedir/imb100/imb10053//upfiles//image/2015/ACHI-HR560/ACHI HR560 BGA rework station 1.jpg
    ACHI HR560, Most Cost-effective Optical Alignment BGA Repair Station

    ACHI HR560 optical Alignment BGA rapair machine main features


    1. 3 tempprature zones.
    2. Latest New Optical Alignment System, easy operate, success rate can be 100%.
    3. Drawer-Sstyle 7“ Highdefinition touch screen.
    4. MCGS programble PLC controller.
    5. Top heater device and mounting head 2 in 1 design.
    6. Semi amtomatic soldering and desoldering.
    7. With Micrometer to do Micro adjust, X Y axis direction moving PCB board,
    8. With Rotating knob to adjust the chip.
    9. With a powerful cross-flow fan to cool PCB rapidly to prevent it from deformation.
    10. Cost-effective and efficient.
    11. Vedio supported.
    12. CE approval


    learn more
  • sitedir/imb100/imb10053//upfiles//image/ACHI-IR12000/ACHI-HR15000/Automatic-BGA-rework-station.jpg
    Latest ACHI HR15000 Semi-Automatic BGA Rework Station

    ACHI HR15000 presents the new trend of BGA rework stations, very easy to operate.

    Highlights of ACHI HR15000 as below:

    1. Latest new optical alignment system, easy to operate, success rate can be 100%.
    2. with laser positioning.
    3. Automatic identify BGA chips ang mounting height.
    4. Top heater device and mounjting head 2 in 1 design.
    5. Semi amtomatic soldering and desoldering.
    6. CCD Ssystem and Optical Alignment System combined, can change the Screen by one button.
    7. Auto matic adjust chiromatism resolution and brightnes.
    8. With Lase opsition.
    9. With Micrometer to do Micro adjust.
    10. With a powerful cross-flow fan to cool PCB rapidly to prevent it from deformation.
    11. With 3 tempretture zone and 3 external temp sensor socket.

    Alignment as below:

    Laser positioning

    CCD Camera for obseving the melting process


    Automatic vacuum pump

    Camera for easy alignment

    Micro-adjust buttons












    learn more
  • sitedir/imb100/imb10053/upfiles/image/OMEGA thermcouple wire.jpg
    OMEGA K-type Thermcouple Wire

     OMEGA K-type Thermcouple Wire provides precise temperature detection

    learn more
  • sitedir/imb100/imb10053/upfiles/image/bga-reballing-kit-1.jpg
    Supply BGA Reballing Kit

     BGA Reballing kit

    BGA reballing kit

    learn more
  • sitedir/imb100/imb10053/upfiles/image/soldering-flux.jpg
    BGA Soldering Flux

    Soldering flux can be widely used in PCB mainboards of diffirent kinds such as computer, notebook, Xbox 360, PS3, PSP, cell phones, automobiles ...
    It is used with BGA solder balls
    BGA sooldering flux

    learn more
  • sitedir/imb100/imb10053/upfiles/image/Lead-free-soder-balls-250k.jpg
    BGA Leaded & Lead Free Solder Balls

    BGA solder balls: leaded solder balls for leaded BGA Rework, melting point 183 degrees. Lead-free solder balls are used for lead-free rework.
    leaded lead-free solder balls 


     

    learn more
  • sitedir/imb100/imb10053/upfiles/image/13932304490.jpg
    BGA Reballing Station Manufacturer

    BGA reballing stations for doing BGA reballing of notebook, Xbox360, notebook, xbox 360, PS3, Wii, PSP, and cell phones. We have diffirent BGA reballing stations for your selection.

    BGA reballing station 

    learn more
  • sitedir/imb100/imb10053/upfiles/image/XBOX360 PS3 mainboard support.jpg
    PS3 XBOX 360 Mainboard Supports

     PS3 XBOX360 Mainboard Supports for xbox 360 fat, xbox 360 slim, PS3 40GB/60GB, PS3 slim 80GB, PS3 120GBPS3 XBOX360 Mainboard Supports

    learn more
  • sitedir/imb100/imb10053/upfiles/image/BGA-Reballing-stencil-kit-90x90.jpg
    BGA Stencil, BGA Reballing Stencil Kit Template Manufacturer

    BGA reballing stencil kit are must for bga reballing. We have latest and diffirent kinds for notebook chips, xbox 360 chips, PS3 chips, Wii Chips, cell phone chips...and also universal bga reballing stencil kit are availble.
    BGA-stencil-kit

     

     

     

     

     

     

     

    learn more
  • sitedir/imb100/imb10053/upfiles/image/BGA accessories pic.jpg
    Other BGA Reballing ACC

    Other BGA reballing accessories such as ESD tweezers,ESD gloves,heatsink material,vacuum suction pens, hign temperature tapes, Foil tapes, desoldering wires,solder wick, BGA scrapers...

    BGA reballing accessories

    learn more
  • sitedir/imb100/imb10053/upfiles/image/ACHI IR12000 Infrared BGA Rework station 2.jpg
    ACHI IR12000 Infrared BGA Rework Station

    ACHI IR12000 Infrared BGA Rework Station 2014 latest released, main features as below:
    1. Three temperature zones : top heater 80x80mm ELSTEIN RFS/80 heater, lower hot air, bottom preheating 350x210mm. They work independently and can be controlled and adjusted to meet actual need

    2. Apply original imported ELSTEIN RFS/80 400W Ceramic from Germany, giving even heating. The max
    temperature could up to 750°C.

    3. Most easy operate infrared bga rework station with 7 inch high definition touch screen. Heating temperature, time, angle, cooling and vacuuming  all can be realized through the touch screen.

    4. Real time setting and actual temperature profile display can be used to analyze and correct parameters when needed.

    5. PID control, instant profile analysis function

    6. Can store unlimited temperature profiles, 2 groups already stored.

    7. Removable fixture and 6pcs rework support jis  it make positioning mainboards much more easy and protect mainboards from damage and deformation efficiently. Irregular mainboards can be repaired too.

    8. Uses advanced OMEGA K-type thermocouple to get accurate temperature detection

    9. Closedloop Temperature control and automatic temperature adjustment system, with PLC and temperature module to enable precision temperature control of ±2 deg C

    10. External temperature sensor enables accurate monitoring and analysis of real time temperature profile.

    11. Equipped with various size BGA air nozzles, they can be adjusted in 360 degrees with easy installation and replacement.

    12. High powered blower to enable fast cooling of PCB board and prolong using life of machine . 

    13.  Internal vacuum pump and external vacuum pen to assist picking up the BGA chip.

    14.  Function of alarming and cooling system.
    The machine will alarm before 5-10 seconds of the soldering or desoldering finished,
    Cooling system will start after vertical wind stopped heating.
    When the temperature drops to room temperature, the cooling process will stop

    15. Emergency Switch and Automatic power -off protection device to help safe using.

    14. USB interface for ungrading the machine software.
    Detailed  pictures for ACHI IR12000 infared BGA rework station

     

    learn more
  • sitedir/imb100/imb10053/upfiles/image/ACHI-IR6500-Infrared-BGA-rework-station-red red (1).jpg
    ACHI IR6500 Infrared BGA Rework Station

    ACHI IR6500 Infrared BGA rework Station is a popular BGA rework station uses advanced dark infrared technology. 1. High temperature tempered glass to make sure even heat.

    2.USB interface easy to be connected with computer.

    3. Support jig added, make locating mainboards eaily.

    4. Advanced external OMEGA K type thermocouple wire provide accurate temperature detection.

    5. Safe emergeny power switch to make sure the machine stop working when emergency happen.

    6. Alarming function. When soldering or desoldering will be finished, it will alarm before 3-5 seconds.

    7. No hot air during rework process, make even heat and protect the surrounding compnents from damage and deformation.

    8. Can store 10 groups of temperature profiles. Two groups already stored for using.

    9. Can be controlled by the IRSOFT temperature software.

    10. Two temperature zones, work independently, temperature parameters are adjustable and correct per actual need.

    11. Can rework BGA chip size large as to 70x70mm
     

    learn more